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CoolIT Systems has introduced a new 4000W cold plate, designed to advance single-phase direct liquid cooling (DLC) technology. This cold plate is capable of dissipating up to 4000 watts of heat, more than doubling the previously accepted limits of single-phase DLC solutions. It utilizes water or a water-glycol mixture to remove heat from semiconductors, achieving over 97% heat capture efficiency during testing. The cold plate also features an ultra-low thermal resistance of less than 0.009°C/W and a full flow loop pressure drop of just 8 PSI, ensuring high thermal performance and energy efficiency. These advancements position the cold plate as a reliable solution for cooling ultra-high-wattage processors, such as those used in AI and high-performance computing.
The 4000W cold plate incorporates CoolIT’s Split-Flow technology, which enhances thermal and flow performance by 30% compared to standard cold plates. This technology also enables targeted cooling for hotspots, making it suitable for next-generation processors with high thermal design power (TDP). CoolIT’s innovation aligns with the growing demand for efficient cooling solutions in data centers and other high-performance environments. By addressing the challenges of heat dissipation in advanced computing systems, the 4000W cold plate demonstrates CoolIT’s leadership in liquid cooling technology and its commitment to supporting the evolving needs of the semiconductor industry.
Image Credit: CoolIt Systems
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